Quartz Ring

Core Features

1. Extreme High-Temperature Resistance

   With a softening point of fused silica glass up to 1730℃, the Quartz Ring can work stably for a long time at 1100℃, and the maximum short-term service temperature reaches 1450℃. It has no deformation or devitrification in high-temperature vacuum or inert gas atmosphere, suitable for scenarios such as high-temperature coating and semiconductor diffusion furnaces.
2. Superior Chemical Stability

   Except for hydrofluoric acid (HF) and concentrated phosphoric acid, it hardly reacts with any acids, alkalis, salts and organic reagents. Its acid resistance is 30 times that of ceramics and 150 times that of stainless steel, enabling long-term use in strong corrosive environments and meeting the stringent requirements of chemical equipment and semiconductor wet processes.
3. Excellent Thermal Shock Resistance

   With an ultra-low thermal expansion coefficient of 0.55×10⁻⁶/℃ (20-300℃), 1/100 of ordinary glass, it can withstand drastic temperature changes from 1100℃ to room temperature without cracking, suitable for working conditions with frequent cold-heat alternation.
4. Full-Spectrum High Optical Transmittance

   Optical-grade Quartz Rings exhibit excellent transmittance across the entire spectrum from ultraviolet (185nm) to infrared (3500nm), with visible light transmittance ≥93% and ultraviolet light (254nm) transmittance ≥80%, making them an ideal choice for optical coating, laser transmission and ultraviolet detection.
5. High Purity and Low Impurities

   Semiconductor-grade Quartz Rings have a total metal impurity content ≤10ppb and hydroxyl content (OH⁻) controllable below 10ppm, with no bubbles, streaks or inclusions, avoiding contamination of semiconductor wafers or optical films.

Technical Parameters (Typical Values)

Application Fields

1. Semiconductor Manufacturing

   Used as wafer carrier rings, coating fixture rings and diffusion furnace accessories in key processes such as wafer lithography, etching and thin film deposition. It ensures high cleanliness and dimensional accuracy during wafer processing, compatible with advanced processes of 28nm and below.
2. Optical Coating and Instruments

   Applied as fixture rings for optical coating machines, lens fixing rings, laser resonator components, and optical path transmission elements for precision optical instruments. Leveraging its high transmittance and dimensional stability, it guarantees the uniformity of optical films and the accuracy of optical paths.
3. Chemical Engineering and Laboratories

   Served as sealing rings for corrosion-resistant reaction vessels, connecting rings for high-temperature pipelines, and core components of laboratory instruments, suitable for chemical reactions and detection in strong acid, strong alkali and high-temperature environments.
4. Other High-End Fields

   Used in optical fiber fixing rings for optical fiber communication equipment, high-temperature fixtures for new energy battery manufacturing, and ultraviolet disinfection components for medical equipment, exerting its comprehensive advantages of high-temperature resistance, corrosion resistance and high transmittance.

Preparation Process

1. Raw Material Purification：High-purity quartz sand or ingots are purified by chemical purification or zone melting to remove metal impurities and hydroxyl groups, obtaining quartz raw materials that meet grade requirements.
2. High-Temperature Melting：The raw materials are melted in graphite or platinum crucibles at 1800-2000℃ to form fused silica glass without bubbles or streaks.
3. Precision Forming：The fused silica glass is formed into annular blanks through pressing, blowing or centrifugal casting, with initial control of inner diameter, outer diameter and thickness.
4. Annealing Treatment：The blanks are annealed at 800-1000℃ for a long time to eliminate internal stress and prevent cracking during subsequent processing and use.
5. Ultra-Precision Machining：The blanks are precision machined through diamond cutting, grinding and polishing to ensure that dimensional tolerance, flatness and surface roughness meet technical requirements.
6. Cleaning and Packaging：Surface impurities are removed by ultra-pure water ultrasonic cleaning and plasma cleaning, followed by vacuum-sealed packaging to prevent contamination during transportation and storage.

Usage and Storage Recommendations

1. Usage Notes：Avoid contact with hydrofluoric acid and concentrated phosphoric acid; slow heating and cooling are required during high-temperature use to reduce thermal shock; optical-grade and semiconductor-grade products should be operated in a clean environment to avoid fingerprint and dust contamination.
2. Cleaning Methods：Surface contamination can be cleaned by ultrasonic cleaning with anhydrous ethanol or acetone; stubborn stains can be soaked in dilute nitric acid and rinsed with ultra-pure water; fluorine-containing cleaners are prohibited.
3. Storage Conditions：Seal and store in a dry and clean environment, avoiding moisture, dust and severe collision; optical-grade and semiconductor-grade products should be individually vacuum-packaged with a shelf life of 12 months.