SiO Target

Core Features

1. Ultra-High Purity and Composition Uniformity

   Raw materials adopt 4N-6N grade (99.99%-99.9999%) high-purity SiO powder. Through multi-stage purification and homogenization, the target’s main component purity reaches ≥99.99%, with impurity content (e.g., metal ions, carbon, oxygen defects) strictly controlled at the ppm level. The overall composition deviation of the target is ＜0.5%, ensuring consistent composition and stable performance of the sputtered film.
2. High Density and Excellent Sputtering Performance

   Utilizing hot pressing or spark plasma sintering (SPS) processes, the target density reaches 95%-99%, significantly reducing particle generation during sputtering. It features stable sputtering rate and uniform film deposition, enabling large-area, high-precision film preparation suitable for continuous industrial production.
3. Customizable Specifications and Microstructure

   Customization is available for target dimensions (circular targets: φ50-φ300mm; rectangular targets: custom sizes), thickness (3-10mm), and bonding methods (copper-backed, molybdenum-backed). By adjusting sintering processes, the target’s microstructure can be optimized to meet the requirements of film stress and adhesion in different sputtering scenarios.
4. Strong Adaptability of Film Functional Characteristics

   Sputtered SiO films have a low refractive index (n=1.5-1.7 in the visible light band) and high optical transmittance (＞90%), along with excellent water/oxygen barrier properties and mechanical wear resistance. Precise control of film refractive index and thickness can be achieved by adjusting sputtering parameters, meeting the functional needs of optical filters, encapsulation layers, etc.

Technical Parameters (Typical Values)

Application Fields

1. Optical Coating Industry: Used to prepare anti-reflection coatings, multi-layer optical film systems for optical lenses, mirrors, and filters. Leveraging its low refractive index and high transmittance, it improves the imaging quality and optical performance of optical devices.
2. Semiconductor and Packaging: Serves as a passivation layer, isolation layer, and packaging buffer layer for semiconductor devices. With excellent insulation and water/oxygen barrier properties, it enhances device reliability and service life.
3. Flexible Displays and Electronics: Used as an encapsulation layer for flexible OLED panels, effectively blocking water vapor and oxygen intrusion to improve the stability of flexible devices. It can also act as an anti-reflection coating for touchscreens to enhance display effects.
4. Solar Cells: Utilized as an anti-reflection or buffer layer for thin-film solar cells, reducing light reflection loss and improving the photoelectric conversion efficiency of cells.

Usage Recommendations

1. Pre-Treatment: Before sputtering, the target should be vacuum-baked at 200-300℃ for 2-4 hours to remove surface-adsorbed moisture and impurities, avoiding adverse effects on film quality.
2. Sputtering Parameters: Magnetron sputtering is recommended, with a vacuum degree ≥5×10⁻⁴ Pa, argon partial pressure 0.3-0.8 Pa, and sputtering power density 2-5 W/cm². Parameters can be adjusted according to target size and film requirements.
3. Storage Conditions: Seal and store in a dry, clean vacuum package. Avoid exposure to humid air or dusty environments to prevent target oxidation or contamination. Shelf life is 12 months under vacuum packaging.