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TiO2 Target

Titanium Dioxide (TiO₂) Target is a ceramic sputtering target with high-purity titanium dioxide as the core component, belonging to the key material for advanced functional thin film preparation. Based on crystal form requirements (Rutile, Anatase), it is prepared by precision processes such as vacuum hot pressing, spark plasma sintering (SPS), and cold isostatic pressing, achieving precise control over target composition uniformity, density, and microstructure. Primarily used in physical vapor deposition (PVD) applications, it deposits TiO₂ thin films on substrate surfaces via magnetron sputtering, electron beam evaporation, and other technologies. The films exhibit excellent optical properties, photoelectric conversion performance, corrosion resistance, and biocompatibility, and are widely applied in high-end manufacturing fields including optical coating, semiconductor devices, solar cells, and decorative coatings.

Core Features

  1. Ultra-High Purity and Controllable Crystal Form Raw materials adopt 4N-6N grade (99.99%-99.9999%) high-purity TiO₂ powder. Through multi-stage purification and crystal form directional control processes, the target’s main component purity reaches ≥99.99%, with impurity content (metal ions, carbon, hydroxyl groups, etc.) controlled at the ppm level. Rutile, Anatase, or mixed crystal type targets can be customized according to customer needs to meet the crystal form requirements of different thin film functional scenarios.
  2. High Density and Stable Sputtering Performance Utilizing advanced sintering processes, the target density reaches 95%-99.5%, significantly reducing the probability of particle and nodule generation during sputtering. It features stable sputtering rate and excellent film deposition uniformity, with a film thickness deviation of <±3% (for large-area deposition), suitable for continuous, high-precision industrial production.
  3. Customizable Specifications and Bonding Solutions Customization is available for target dimensions (circular targets: φ30-φ400mm; rectangular targets: maximum 1000×500mm), thickness (3-15mm), and bonding methods (oxygen-free copper-backed, molybdenum-backed, aluminum-backed). For special application scenarios, doped TiO₂ Targets (e.g., Nb-doped, Ta-doped) can also be provided to regulate the conductive or photoelectric properties of the film.
  4. Multifunctional Performance Advantages of Films Sputtered TiO₂ films exhibit excellent performance in multiple dimensions:
    • Optical Field: High refractive index (n=2.4-2.7 in the visible light band) and high transmittance (>85%), enabling optical functions such as anti-reflection and high reflection;
    • Photoelectric Field: Excellent photoelectric conversion efficiency and photocatalytic activity, suitable for solar cells and self-cleaning coatings;
    • Protection Field: Acid and alkali corrosion resistance, high hardness (HV≥600), usable as wear-resistant and corrosion-resistant protective coatings.

Technical Parameters (Typical Values)

Item Index Range (Rutile) Index Range (Anatase)
Main Component Purity ≥99.99% (4N) / ≥99.999% (5N) ≥99.99% (4N)
Density 96%-99.5% 95%-98%
Total Impurity Content ≤100 ppm (4N) / ≤10 ppm (5N) ≤100 ppm (4N)
Crystal Form Purity ≥99% ≥98%
Grain Size 5-30 μm 10-50 μm
Hardness (HV) 600-800 400-600
Common Specifications Circular: φ76.2×6mm, φ101.6×6mm, φ200×8mm; Rectangular: Customizable Circular: φ50×6mm, φ76.2×6mm; Rectangular: Customizable
Bonding Method Oxygen-free copper backing, molybdenum backing, non-backed Oxygen-free copper backing, non-backed
Maximum Service Temperature ≤800℃ (vacuum environment) ≤600℃ (vacuum environment)

Application Fields

  1. Optical Coating Industry: Used to prepare high-reflection films, anti-reflection films, and multi-layer optical film systems for optical lenses, mirrors, and filters. Leveraging its high refractive index, it achieves precise light control of optical devices; it can also be used for anti-reflection coatings and infrared cutoff coatings of display panels.
  2. Semiconductor and Optoelectronic Field: Serves as a gate dielectric layer, passivation layer for semiconductor devices, and doped substrate for transparent conductive films; in the photovoltaic field, it can be used as an electron transport layer for perovskite solar cells to improve cell photoelectric conversion efficiency.
  3. Decorative and Protective Coatings: Used for decorative coatings (e.g., gold, blue films) on hardware, architectural glass, and auto parts, combining aesthetics with corrosion resistance; it can also be used as a wear-resistant protective coating for cutting tools and molds to extend service life.
  4. Functional Thin Film Field: Used to prepare photocatalytic self-cleaning coatings, antibacterial coatings, and anti-fog coatings, applicable to building exteriors, medical devices, and auto glass; it can also be used as a flexible transparent electrode substrate for flexible electronic devices.

Usage Recommendations

  1. Pre-Treatment: Before sputtering, vacuum baking is required at 300-400℃ for 2-4 hours to remove surface-adsorbed moisture, hydroxyl groups, and impurities, avoiding adverse effects on film purity and performance.
  2. Sputtering Parameters: Magnetron sputtering is recommended, with a vacuum degree ≥5×10⁻⁴ Pa, and the working gas is argon (or argon-oxygen mixed gas). The argon-oxygen ratio can be adjusted according to the film crystal form requirements, with a sputtering power density of 3-8 W/cm².
  3. Storage Conditions: Seal and store in a dry, clean vacuum package. Avoid exposure to humid air or dusty environments to prevent target surface hydration or contamination. The shelf life is 12 months under vacuum packaging.


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