CONTACTS
ADD :Jinfeng Town, Chongqing of China
TEL :0086-138 9636 7407
MAIL:sales@sio2.company
WEB :www.sio2.company
TEL :0086-138 9636 7407
MAIL:sales@sio2.company
WEB :www.sio2.company
Thermal Spray Silicon Rotating Target
Thermal Spray Silicon Rotating Target is a core consumable for magnetron sputtering deposition of silicon‑based films, made by depositing high‑purity silicon powder onto stainless steel backing tubes via plasma thermal spraying and other thermal spray processes. It adopts an integrated process of “backing tube pretreatment + bond coating + plasma thermal spraying + post‑processing”. With high coating density and uniform composition, the target is suitable for continuous rotating sputtering, achieving a material utilization rate of 60% - 80% (much higher than planar targets). It is widely used in Low‑E glass, optical coating, semiconductor devices, display panels and other fields for efficient deposition of functional films such as SiO₂ and Si₃N₄.
Core Features
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High Purity and Controllable Composition
Raw materials use 3N - 6N (99.9% - 99.9999%) high‑purity silicon powder. After multi‑stage purification, the main component purity of the coating is ≥99.99%, and the content of metallic impurities (Fe, Cu, Ni, etc.), carbon and oxygen is controlled at the ppm level. Boron (B) or phosphorus (P) doping is available with precisely controllable concentration to meet the requirements of conductive or functional films.
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High Density and Stable Bonding
Plasma thermal spraying melts silicon powder rapidly and deposits it at high speed, resulting in a coating density ≥2.2 g/cm³ with a density uniformity deviation ≤±2%. The backing tube is treated with sandblasting and bond coating, ensuring a bonding strength ≥20 MPa between the coating and 304/316L non‑magnetic stainless steel backing tube, avoiding coating peeling or bulging during sputtering.
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High‑Efficiency Sputtering and Long Service Life
The rotating structure prevents local “striped craters”, ensuring stable sputtering rate and excellent film uniformity (film thickness deviation <±3%). The target utilization rate reaches 60% - 80%, and the service life of a single target is more than 50% longer than that of planar targets, suitable for continuous industrial production.
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Full‑Specification Customization
Customizable backing tube outer diameter (φ50 - φ300 mm), target length (≤4000 mm) and coating thickness (3 - 15 mm), supporting special step and end face processing. It is compatible with the interfaces and cooling systems of different magnetron sputtering equipment, as well as argon or argon‑nitrogen/argon‑oxygen mixed gas sputtering.
Technical Parameters (Typical Values)
| Item | Index Range | Remarks |
|---|---|---|
| Coating Purity | ≥99.99% (4N) | 5N - 6N ultra‑high purity grade available on request |
| Density | ≥2.2 g/cm³ | Density uniformity deviation ≤±2% |
| Bonding Strength | ≥20 MPa | No risk of coating peeling from the backing tube |
| Resistivity | 0.01 - 30 Ω·cm | Doped type can be as low as 0.01 Ω·cm |
| Backing Tube Material | 304/316L non‑magnetic stainless steel | Titanium alloy backing tube optional |
| Dimension Specifications | Outer diameter φ50 - φ300 mm, length ≤4000 mm, coating thickness 3 - 15 mm | Custom special dimensions available |
| Applicable Temperature | ≤800℃ (vacuum environment) | Cooling water flow required during sputtering |
| Total Impurity Content | ≤50 ppm | Metallic impurities ≤10 ppm |
Application Fields
- Architectural and Energy‑Saving Glass: Used for low‑emissivity coatings of Low‑E glass, depositing Si₃N₄ isolation layers and SiO₂ protective layers to improve thermal insulation and light transmission performance, suitable for large‑scale glass coating production lines.
- Optics and Display: Applied in anti‑reflection/high‑reflection films for optical lenses and touch screen AR film systems, as well as passivation layers and buffer layers for display panels, ensuring optical uniformity and stability of thin films.
- Semiconductor and Photovoltaics: Serves as SiO₂ gate dielectric layers and Si₃N₄ passivation layers for semiconductor devices; surface passivation films for photovoltaic cells to improve photoelectric conversion efficiency.
- Decorative and Functional Coatings: Used for wear‑resistant/corrosion‑resistant silicon‑based coatings on hardware and auto parts, combining decoration and protection.
Preparation Process
- Backing Tube Pretreatment: Select 304/316L stainless steel backing tubes, perform sandblasting roughening and ultrasonic cleaning to remove oil stains and oxide layers, improving bonding strength.
- Bond Coating: Spray nickel‑chromium (NiCr) or aluminum‑based bond coating with a thickness of 50 - 100 μm to avoid thermal expansion mismatch between the coating and the backing tube.
- Plasma Thermal Spraying: High‑purity silicon powder (particle size ‑150~+300 mesh) is heated and melted by plasma flame (Ar as main gas, H₂ as auxiliary gas), and rapidly deposited on the surface of the rotating backing tube. The spraying voltage is controlled at 66 - 70 V and current at 540 - 560 A.
- Post‑processing: Turning and polishing to ensure the coating surface roughness Ra ≤0.8 μm and dimensional tolerance within ±0.05 mm.
Usage and Storage Recommendations
- Pre‑treatment: Vacuum baking at 200 - 300℃ for 2 - 4 hours before sputtering to remove surface‑adsorbed moisture and impurities, avoiding film contamination.
- Sputtering Parameters: A vacuum degree ≥5×10⁻⁴ Pa is recommended, with argon (or mixed gas) as the working gas. The sputtering power density is 3 - 6 W/cm², the rotation speed is 5 - 15 r/min, and the backing tube cooling (water temperature 20 - 30℃) should be turned on simultaneously.
- Storage: Seal and store in a dry and clean vacuum package, avoiding moisture and dust contamination. The shelf life is 12 months under vacuum packaging.
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