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TEL :0086-138 9636 7407
MAIL:sales@sio2.company
WEB :www.sio2.company
Silicon Ring
Silicon Ring is a ring-shaped functional component prepared from high-purity silicon through precision molding, cutting, polishing and other processes, belonging to the key basic material in the semiconductor and precision manufacturing fields. According to purity levels and application scenarios, it can be divided into semiconductor-grade Silicon Rings (made of electronic-grade high-purity silicon), optical-grade Silicon Rings (made of high-transmittance, low-defect silicon materials) and industrial-grade Silicon Rings (made of ordinary high-purity silicon). It has excellent mechanical strength, thermal stability, electrical properties and optical compatibility, and is widely used in high-end fields such as semiconductor wafer processing, optical coating fixtures, vacuum equipment sealing, and photovoltaic cell manufacturing. It is a core auxiliary component for achieving high-precision and high-reliability production.
Core Features
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Ultra-High Purity and Low Impurity ContentSemiconductor-grade Silicon Rings are made of 6N-7N grade (99.9999%-99.99999%) high-purity polycrystalline or monocrystalline silicon. Through zone melting purification and precision processing, the total content of metal impurities is ≤1 ppb, and the content of carbon and oxygen impurities is ≤5 ppb. This ensures no impurity contamination during semiconductor wafer processing and meets the ultra-high cleanliness requirements of chip manufacturing.
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Excellent Thermal Stability and Mechanical PropertiesSilicon Rings have a melting point of up to 1414℃, and exhibit excellent dimensional stability in high-temperature (≤1200℃) vacuum or inert gas environments. The thermal expansion coefficient is as low as 2.6×10⁻⁶ /℃ (room temperature - 1000℃), which can effectively avoid deformation and cracking during high-temperature processing. At the same time, it has high hardness (HV≥1100), high wear resistance and low brittleness, and can withstand high-frequency mechanical contact and friction for a long time.
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Precise Dimensional Accuracy and Surface QualityAdopting ultra-precision cutting and chemical mechanical polishing (CMP) processes, the diameter tolerance of Silicon Rings can be controlled within ±0.005 mm, thickness tolerance within ±0.002 mm, flatness ≤0.001 mm, and surface roughness Ra≤0.005 μm. There are no scratches, chipping or micropore defects, meeting the stringent requirements for component surfaces in optical coating and semiconductor processing.
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Customizable Specifications and Functional AdaptabilityCustomization of inner diameter, outer diameter, thickness, step structure and chamfer size is available according to customer needs. Custom production of monocrystalline Silicon Rings, polycrystalline Silicon Rings and doped Silicon Rings (such as boron-doped, phosphorus-doped) is supported. For different application scenarios, surface modification treatments such as nitridation and oxidation can be provided to improve corrosion resistance and electrical properties.
Technical Parameters (Typical Values)
| Item | Semiconductor-Grade Silicon Ring | Optical-Grade Silicon Ring | Industrial-Grade Silicon Ring |
|---|---|---|---|
| Raw Material Purity | 6N-7N | 5N-6N | 4N-5N |
| Total Impurity Content | ≤1 ppb | ≤10 ppb | ≤100 ppb |
| Thermal Expansion Coefficient | 2.6×10⁻⁶ /℃ | 2.6×10⁻⁶ /℃ | 2.6×10⁻⁶ /℃ |
| Melting Point | 1414℃ | 1414℃ | 1414℃ |
| Hardness (HV) | ≥1100 | ≥1000 | ≥900 |
| Diameter Tolerance | ±0.005 mm | ±0.01 mm | ±0.05 mm |
| Thickness Tolerance | ±0.002 mm | ±0.005 mm | ±0.02 mm |
| Surface Roughness (Ra) | ≤0.005 μm | ≤0.01 μm | ≤0.1 μm |
| Applicable Temperature Range | -200℃~1200℃ | -100℃~1000℃ | -50℃~800℃ |
Application Fields
- Semiconductor Manufacturing: Used as wafer carrier rings, etching fixture rings and coating mask rings in key processes such as wafer lithography, etching and thin film deposition. It ensures precise positioning and no impurity contamination of wafers, and is suitable for the manufacturing of chips with advanced processes of 28 nm and below.
- Optical Coating: Used as coating fixture rings for optical components (such as lenses and mirrors). With its high dimensional accuracy and low impurity characteristics, it ensures the uniformity and consistency of coatings, and avoids contamination of optical film layers by fixtures.
- Vacuum Equipment: Used as sealing rings or support rings for ultra-high vacuum equipment. Thanks to its excellent thermal stability and low outgassing rate, it is suitable for the vacuum systems of vacuum coating machines, electron microscopes, nuclear fusion experimental devices and other equipment.
- Photovoltaics and Electronics: Used in cutting and sorting fixtures for photovoltaic cell silicon wafers, as well as heat dissipation support rings for high-power electronic devices. With its good thermal conductivity and mechanical stability, it improves production efficiency and device reliability.
Usage Recommendations
- Cleaning and Pre-Treatment: Before use, it is necessary to perform ultra-pure water ultrasonic cleaning, plasma cleaning or high-temperature baking (200-300℃, vacuum environment) to remove dust, organic matter and water vapor adsorbed on the surface, avoiding contamination of processed objects.
- Installation and Use: Install with special precision fixtures to avoid direct manual contact with the surface; control the environmental cleanliness during use (Class 10 or higher clean room is required for semiconductor-grade applications) to prevent adhesion of impurity particles.
- Storage Conditions: Seal and store in a clean, dry vacuum package, avoiding exposure to humid and dusty environments; semiconductor-grade Silicon Rings should be stored separately to prevent cross-contamination with other grade materials. The shelf life is 12 months under vacuum packaging conditions.
